Dr. Lisa Tondelli, PhD in ICT in 2026, received the Best paper runner-up award at the iTherm 2026 Conference in Orlando (FL), USA for the component-level thermal management track. The award recognizes the relevance and timeliness of her contributions to understand over-heating phenomena in modern CMOS technologies, a result achieved during the 38th cycle PhD programme she recently completed.The research was partly carried out at imec (BE), a worldwide top raking European institution where she spent a few months leave of absence in the first half of 2025.

ITherm is a leading international conference in electronic thermal and thermomechanical management, a very important topic in today's electronics, due to the impetuous rise in components complexity and density caused by the extensive implementation of three-dimensional intergration technologies. The conference brings together top researchers and industry experts working on advanced cooling, reliability, and packaging technologies.

In her work, Dr. Tondelli investigated the sensitivity to technological parameters of the power dissipation pathways in advanced FinFET and FDSOI transistors, thus contributing to identify impactful device design guidelines.